本文采用快速黏度分析仪(RVA)、流变仪、扫描电镜(SEM)对干热处理前后的普通玉米淀粉(CS)和蜡质玉米淀粉(WCS)与大豆分离蛋白(SPI)共混物的糊化特性、流变特性以及微观结构进行了研究。实验结果表明，与SPI干热处理后，淀粉的黏度明显增加，而WCS黏度的增加相比于CS更加明显。与未经干热处理的样品相比，干热混合物的G’、G”值显著增加，tanδ值明显降低。表明干热处理后，糊化后的淀粉凝胶网络结构增强，更加偏向于类固体的性质。SEM结果显示，与SPI干热使淀粉产生了聚集，CS/SPI产生了较小的聚集，而WCS/SPI形成了更大的块状聚集体。淀粉颗粒之间的聚集表明淀粉与SPI经干热处理后发生了相互作用，并且WCS与SPI的交互作用更加明显。SPI辅助干热改性可以作为蜡质玉米淀粉改性的新方法。

The pasting and rheological properties and the microstructure of normal cornstarch (CS) and waxy cornstarch (WCS) mixed with soy protein isolate (SPI) were characterized before and after dry heating using a rapid visco analyser (RVA), a rheometer, and by scanning electron microscopy (SEM). Dry heating with SPI led to a significant increase in starch viscosity; the increase in viscosity of WCS was observed to be more pronounced than that of CS. There was a significant increase in the G′ and G′′ values and a corresponding decrease in the tan δ value of the dry heated mixtures, compared to those of untreated starch. This indicated an increase in gel network structure formation in pasted starch after dry heating; in fact, the gel network of heated pasted starch became more solid-like compared to that observed in untreated starch. The SEM images revealed the occurrence of starch accumulation after dry heating of starch with SPI; in addition, compared to CS/SPI, WCS/SPI was observed to form a larger lump. The accumulation of starch molecules suggested the occurrence of interactions between starch and SPI after dry heating; the interactions of WCS and SPI were more pronounced than those of CS and SPI. This simple heating process (with SPI) could be used as a promising method for the modification of WCS.

山东省科技发展计划项目（2012GNC11306）